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Resin compounds are nowadays used for many different purposes and their application fields are increasing every day.
Potting and encapsulation is the process of embedding electronic components and assemblies in a liquid resin (potting compounds) to protect them against rough environment conditions. Potting can be performed in atmosphere pressure or even under vacuum, if high voltage insulation and high temperature differences are needed. Encapsulation of parts will stop corrosion of metals and reduce damage caused by vibration and mechanical stress.
It is possible handle 1- and 2-component polyurethanes, epoxies, acrylics, silicones - temperature, humidity and UV curing materials. They can be from low- to high-viscosity, filled or unfilled and even high abrasive for thermal conductivity.
Within this process it is possible to protect sensibles circuitry against water, vibrations, etc... DAVE Embedded Systems and its partners it is able to perform this phase with the most modern equipments in order to satisfy the customers in any business environment.
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